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In order to print the smallest structures in silicon, a massive ASML Twinscan machine is needed. Current generation technology can create line widths of 13nm, and those machines cost $150m. The new generation can go down to 8nm, and cost a massive $350m! In this video, we tour Intel's Oregon Fab where they've completed installing the world's first commercial High-NA EUV machine. It's in the calibration phase now, ready for testing. [00:00] Twinscan NXE:5000 [01:20] NA and EUV [03:00] Installation Logistics [04:30] FIRING MAH LAZOR [07:20] 10nm Line Widths [09:20] 14A Roadmap... and Hyper-NA [12:25] Touring The Fab [14:15] Dr. Mark Phillips [15:30] Tin Droplet Suppliers [17:00] Visiting Other Fabs ----------------------- Need POTATO merch? There's a chip for that! http://merch.techtechpotato.com http://more-moore.com : Sign up to the More Than Moore Newsletter / techtechpotato : Patreon gets you access to the TTP Discord server! Follow Ian on Twitter at / iancutress Follow TechTechPotato on Twitter at / techtechpotato If you're in the market for something from Amazon, please use the following links. TTP may receive a commission if you purchase anything through these links. Amazon USA : https://geni.us/AmazonUS-TTP Amazon UK : https://geni.us/AmazonUK-TTP Amazon CAN : https://geni.us/AmazonCAN-TTP Amazon GER : https://geni.us/AmazonDE-TTP Amazon Other : https://geni.us/TTPAmazonOther Ending music: • An Jone - Night Run Away ----------------------- Welcome to the TechTechPotato (c) Dr. Ian Cutress Ramblings about things related to Technology from an analyst for More Than Moore #intel #highna #asml ------------ More Than Moore, as with other research and analyst firms, provides or has provided paid research, analysis, advising, or consulting to many high-tech companies in the industry, which may include advertising on TTP. The companies that fall under this banner include AMD, Applied Materials, Armari, Baidu, Facebook, IBM, Infineon, Intel, Lattice Semi, Linode, MediaTek, NordPass, ProteanTecs, Qualcomm, SiFive, Supermicro, Tenstorrent, TSMC.