Скачать с ютуб TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT в хорошем качестве

TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT

TSMC's Jim Chang took the stage at the 2023 TSMC Technology Symposium to talk about TSMC 3Dblox™, a standard to address the rising complexity of 3D IC design and unify the design ecosystem with qualified EDA tools and flows for TSMC 3DFabric technology. The modularized TSMC 3Dblox standard is designed to model, in one format, the key physical stacking and the logical connectivity information in 3D IC designs. TSMC has worked with EDA partners in the 3DFabric alliance to enable 3Dblox for every aspect of 3D IC designs, including physical implementation, timing verification, physical verification, electro-migration IR drop (EMIR) analysis, thermal analysis, and more. TSMC 3Dblox is designed to maximize flexibility and ease of use, offering ultimate 3D IC design productivity.